? semiconductor components industries, llc, 2012 february, 2012 ? rev. 5 1 publication order number: nup2301mw6t1/d nup2301mw6t1g, SZNUP2301MW6T1G low capacitance diode array for esd protection in two data lines nup2301mw6t1g is a micro ? integrated device designed to provide protection for sensitive components from possible harmful electrical transients; for example, esd (electrostatic discharge). features ? low capacitance (2.0 pf maximum between i/o lines) ? single package integration design ? provides esd protection for jedec standards jesd22 machine model = class c human body model = class 3b ? protection for iec61000 ? 4 ? 2 (level 4) 8.0 kv (contact) 15 kv (air) ? ensures data line speed and integrity ? fewer components and less board space ? direct the transient to either positive side or to the ground ? sz prefix for automotive and other applications requiring unique site and control change requirements; aec ? q101 qualified and ppap capable ? this is a pb ? free device* applications ? t1/e1 secondary ic protection ? t3/e3 secondary ic protection ? hdsl, idsl secondary ic protection ? video line protection ? microcontroller input protection ? base stations ? i 2 c bus protection *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. device package shipping ? ordering information marking diagram sc ? 88 case 419b style 23 68 = specific device code m = date code n/c v n i/o v p 6 5 4 i/o n/c 1 2 3 pin configuration and schematic http://onsemi.com ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our t ape and reel packaging specifications brochure, brd8011/d. nup2301mw6t1g sc ? 88 (pb ? free) 3,000 / tape & reel 68 m 1 6 SZNUP2301MW6T1G sc ? 88 (pb ? free) 3,000 / tape & reel
nup2301mw6t1g, SZNUP2301MW6T1G http://onsemi.com 2 maximum ratings (each diode) (t j = 25 ? c unless otherwise noted) rating symbol value unit reverse voltage v r 70 vdc forward current i f 200 madc peak forward surge current i fm(surge) 500 madc repetitive peak reverse voltage v rrm 70 v average rectified forward current (note 1) (averaged over any 20 ms period) i f(av) 715 ma repetitive peak forward current i frm 450 ma non ? repetitive peak forward current t = 1.0 s t = 1.0 ms t = 1.0 s i fsm 2.0 1.0 0.5 a stresses exceeding maximum ratings may damage the device. maximum ratings are stress ratings only. functional operation above t he recommended operating conditions is not implied. extended exposure to stresses above the recommended operating conditions may af fect device reliability. 1. fr ? 5 = 1.0 0.75 0.062 in. thermal characteristics characteristic symbol max unit thermal resistance junction ? to ? ambient r ja 625 ? c/w lead solder temperature maximum 10 seconds duration t l 260 ? c junction temperature t j ? 55 to +150 ? c storage temperature t stg ? 55 to +150 ? c electrical characteristics (t j = 25 ? c unless otherwise noted) (each diode) characteristic symbol min typ max unit off characteristics reverse breakdown voltage (i (br) = 100 a) v (br) 70 ? ? vdc reverse voltage leakage current (v r = 70 vdc) (v r = 25 vdc, t j = 150 ? c) (v r = 70 vdc, t j = 150 ? c) i r ? ? ? ? ? ? 2.5 30 50 adc capacitance (between i/o pins) (v r = 0 v, f = 1.0 mhz) c d ? 1.0 2.0 pf capacitance (between i/o pin and ground) (v r = 0 v, f = 1.0 mhz) c d ? 1.6 3 pf forward voltage (i f = 1.0 madc) (i f = 10 madc) (i f = 50 madc) (i f = 150 madc) v f ? ? ? ? ? ? ? ? 715 855 1000 1250 mv dc 2. fr ? 5 = 1.0 0.75 0.062 in. 3. alumina = 0.4 0.3 0.024 in. 99.5% alumina. 4. include sz-prefix devices where applicable.
nup2301mw6t1g, SZNUP2301MW6T1G http://onsemi.com 3 100 0.2 0.4 v f , forward voltage (v) 0.6 0.8 1.0 1.2 10 1.0 0.1 t a = 85 ? c 10 0 v r , reverse voltage (v) 1.0 0.1 0.01 0.001 10 20 30 40 50 1.75 0 v r , reverse voltage (v) 1.5 1.25 1.0 0.75 2468 figure 1. forward voltage figure 2. leakage current figure 3. capacitance t a = -40 ? c t a = 25 ? c t a = 150 ? c t a = 125 ? c t a = 85 ? c t a = 55 ? c t a = 25 ? c i r , reverse current ( a) c d , diode capacitance (pf) i f , forward current (ma)
nup2301mw6t1g, SZNUP2301MW6T1G http://onsemi.com 4 package dimensions notes: 1. dimensioning and tolerancing per ansi y14.5m, 1982. 2. controlling dimension: inch. 3. 419b ? 01 obsolete, new standard 419b ? 02. e 0.2 (0.008) mm 123 d e a1 a a3 c l 654 ? e ? b 6 pl dim min nom max millimeters a 0.80 0.95 1.10 a1 0.00 0.05 0.10 a3 b 0.10 0.21 0.30 c 0.10 0.14 0.25 d 1.80 2.00 2.20 0.031 0.037 0.043 0.000 0.002 0.004 0.004 0.008 0.012 0.004 0.005 0.010 0.070 0.078 0.086 min nom max inches 0.20 ref 0.008 ref h e h e e 1.15 1.25 1.35 e 0.65 bsc l 0.10 0.20 0.30 2.00 2.10 2.20 0.045 0.049 0.053 0.026 bsc 0.004 0.008 0.012 0.078 0.082 0.086 sc ? 88/sc70 ? 6/sot ? 363 case 419b ? 02 issue w mm inches scale 20:1 0.65 0.025 0.65 0.025 0.50 0.0197 0.40 0.0157 1.9 0.0748 *for additional information on our pb ? free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. soldering footprint* style 23: pin 1. vn 2. ch1 3. vp 4. n/c 5. ch2 6. n/c on semiconductor and are registered trademarks of semiconductor components industries, llc (scillc). scillc reserves the right to mak e changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for an y particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including wi thout limitation special, consequential or incidental damages. ?typical? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different application s and actual performance may vary over time. all operating parameters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the rights of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the scillc product could create a sit uation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer shall indemnify and hold scillc and its of ficers, employees, subsidiaries, af filiates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, direct ly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. publication ordering information n. american technical support : 800 ? 282 ? 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 ? 3 ? 5817 ? 1050 nup2301mw6t1/d literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone : 303 ? 675 ? 2175 or 800 ? 344 ? 3860 toll free usa/canada fax : 303 ? 675 ? 2176 or 800 ? 344 ? 3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your local sales representative
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